American CIF Plasma Cleaner cleaning principle:
Plasma is a state of existence of matter. Usually, the substance exists in three states: solid, liquid, and gaseous. However, in some special cases, there is a fourth state of existence, such as substances in the ionosphere in the Earth's atmosphere. The following substances exist in the plasma state: electrons in a high-speed motion state; neutral atoms, molecules, atomic groups (free radicals) in an activated state; ionized atoms, molecules; unreacted molecules, atoms, etc., but substances in the whole It remains electrically neutral.
Plasma cleaning machine is to treat the surface of the sample by utilizing the properties of these active components, and to clean the surface of the product by plasma bombardment with a high-energy disordered plasma of a high-energy product under a certain pressure by a radio frequency power source, thereby achieving cleaning, Modification, photoresist ashing and other purposes.
The US CIF Plasma Cleaner has three common uses:
1. Degreasing and cleaning of metal surfaces: Metal surfaces often have organic substances such as grease and oil, and oxide layers. Before sputtering, painting, bonding, bonding, soldering, brazing, and PVD, CVD coating, Plasma treatment to obtain a completely clean and oxide-free surface. Plasma treatment in this case produces the following effects:
- Ashing the surface organic layer
- the surface will be subject to physical bombardment and chemical treatment
- Partial evaporation of contaminants under vacuum and transient high temperature - Contaminants are crushed under the impact of high energy ions and pumped out by vacuum pump - UV radiation destroys contaminants because plasma treatment can only penetrate a few nanometers per second So the pollution layer should not be too thick. Fingerprints also apply.
- Oxide removal
Metal oxides react chemically with process gases
This treatment uses hydrogen or a mixture of hydrogen and argon. Sometimes a two-step process is also used. The first step is to oxidize the surface with oxygen, and the second step is to remove the oxide layer with a mixed gas of hydrogen and argon. It can also be treated with several gases at the same time.
- welding
Typically, printed wiring boards (PCBs) are treated with chemical fluxes prior to soldering. These chemicals must be removed by plasma after the soldering is completed, otherwise corrosion and other problems may occur. Good bonding is often impaired by plating, bonding, and residue during soldering operations, and these residues can be selectively removed by plasma methods. At the same time, the oxide layer is also detrimental to the quality of the bond, and plasma cleaning is also required.
2. Treatment of Plasma Etch: During the plasma etching process, the etched material becomes a gas phase by the action of the processing gas. The process gas and matrix material are pumped out by a vacuum pump and the surface is continuously covered by fresh process gas. It is not desirable to cover the portion to be etched with materials. The plasma method is also used to etch the surface of the plastic, and the mixture can be ashed by oxygen to obtain a distribution analysis. The etching method is very important as a pretreatment means in plastic printing and bonding. Plasma treatment can greatly increase the bond wetted area and increase the bond strength.
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